Radiation scanning systems and methods

ABSTRACT

An apparatus may comprise a frame supporting at least first and second skewed radiation sources and at least first and second radiation detectors. The first and second radiation detectors may be substantially non-contiguous such that a substantial gap exists between the first and second radiation detectors that is free of any radiation detectors. Each of the first and second radiation detectors may also configured and arranged to detect radiation emitted by each of the first and second skewed radiation sources.

This application claims the benefit under 35 U.S.C. §119(e) of each ofU.S. Provisional Application Ser. No. 60/771,758, filed Feb. 9, 2006,and U.S. Provisional Application Ser. No. 60/855,565, filed Oct. 31,2006. The entire contents of each of the foregoing applications isincorporated herein by reference.

BACKGROUND

Inspection systems are widely used to provide security, such as atairports or other facilities, wherever it is desired to create a securedarea. Generally, one or more inspection systems are established at acheckpoint. Items passing the checkpoint are inspected to determinewhether a weapon, explosive or other contraband is concealed within theitem.

It has long been known that penetrating radiation (such as x-rays) maybe used to characterize the contents of parcels, luggage, etc. The term“x-rays” refers to electromagnetic radiation of a very short wavelengththat is capable of penetrating many objects. An x-ray “beam” may beformed by a device called a “collimator,” which effectively absorbs allx-rays except those traveling in the desired beam direction. Forexample, if an x-ray source produces x-rays that are directed generallytoward a collimator having a slit, the x-rays that hit the surface ofthe collimator will be absorbed, while the x-rays that pass through theslit will form a beam in the shape of a fan, commonly called a “fanbeam.”

The contents of an item may be characterized by placing an array ofx-ray “detectors” on the opposite side of the item from the x-ray sourceand collimator, and causing the beam of x-rays to pass through the itembefore impinging upon the detectors. The detector array may, forexample, include a planar array of hundreds or thousands of discretedetectors that are intercepted by a cone-shaped x-ray beam, or, as ismore common in baggage inspection systems, may include a linear array ofdetectors that are intercepted by a collimated fan beam. Each detectorin an array generates an electronic signal having a magnitude thatcorresponds to the intensity of the x-rays that impacted it during a“sample interval.” Because higher-density materials in the item beingscanned will absorb more x-rays than lower-density materials, the signaloutput by the detectors that are in the “shadow” of higher-densitymaterials will be lower in value than the signal output by thosedetectors that are intercepted by x-rays that pass only throughlower-density materials.

By using a conveyor, e.g., a conveyor belt or a set of rollers, to movean item though the plane of a fan beam, a series of “lines” of x-raytransmission data may be accumulated by a linear array of detectorsintercepted by the beam. Each such line of data would represent a sampleinterval, for the entire array of detectors, taken when the item on theconveyor was at a particular position with respect to the fanbeam/detector array. Using these lines of data, an image (i.e., acollection of data that represents the item under inspection) may begenerated having a resolution that depends upon the number of detectorsin the array, as well as the number of lines of data that wereaccumulated. As a practical matter, the number of data points, or“pixels,” in such an image will be limited by the number of detectors inthe array multiplied by the accumulated number of lines of data.

The data points included in an image can represent any of a number ofparameters. In some systems, the data points simply represent theintensity values that are measured by the respective detectors. In othersystems, the data points represent attenuation measurements that arecalculated, for example, by taking the inverse natural logarithm of theratio of the radiation intensity measured by the detectors to theintensity of the incident radiation. In yet other systems, the datapoints represent linear density measurements that are determined basedupon the calculated attenuation measurements in addition to other knownparameters, such as the distance between the source and detectors,according to well-known equations and techniques. In still other systemsin which the thickness of the item under inspection can somehow bemeasured or approximated in the direction of the rays that intersect theitem under inspection, the volumetric density of corresponding sectionsof the item under inspection can also be calculated and used to formdata points in an image.

Conventional x-ray scanners frequently determine a linear density atnumerous points throughout an item under inspection. Because objectsthat may be inside the item under inspection frequently haverecognizable density profiles, a density image formed with the x-rayscanner can provide useful information about objects inside the itemunder inspection. In some inspection systems, the density image ispresented visually to a human operator. In other systems, computerizedsystems are used to automatically process the image to identify adensity profile that is characteristic of a contraband object.

Images formed by many inspection systems are these types oftwo-dimensional projection images. Because attenuation of the radiationis related to the density of the material through which the radiationpassed, making x-ray projection images in this fashion is useful todetect many types of contraband. For example, rays of radiation passingthrough a gun, knife or other relatively dense object will be highlyattenuated. Each pixel in the image formed by measuring rays passingthrough such an object will appear very different from other pixels inthe image. More generally, contraband objects are likely to appear inthe image as a group of pixels having an attenuation different than thatof other surrounding pixels. The group will form a region with anoutline conforming to the silhouette of the object. Such a group ofpixels may be identified as a “suspicious region” based on manual orautomated processing if it has a shape and size that matches acontraband item. Densities, or other measured material properties, ofthe pixels in the group also may be used in the processing to identifysuspicious regions.

Inspection systems are not limited to forming images based on density.Any measurable material property may be used to form an image insteadof, or in addition to, density. For example, multienergy x-rayinspection systems may measure an effective atomic number, or “Z_(eff),”of regions within an item under inspection and may form images based onthe effective atomic number measurements. In a dual energy system, forinstance, detector samples may be taken for x-rays at each of twodiscrete energy levels, and an analysis may be performed on theaccumulated data to identify the effective atomic number of the portionof the item that was intercepted by the x-rays during the sampleinterval. This is possible because it is known that the ratio of theintensities of the samples at the two energies is indicative of theeffective atomic number.

If no suspicious region is detected in an image of an item underinspection, the item may be “cleared” and allowed to pass thecheckpoint. However, if a suspicious region is found in the image, theitem may be “alarmed.” Processing of an item in response to an alarm maydepend on the purpose of the inspection. For example, an alarmed itemmay be inspected further, destroyed, blocked from passing thecheckpoint, or processed in any other suitable way.

Projection imaging is well suited for finding objects that are denseenough and large enough to produce a group of pixels having arecognizable outline regardless of the orientation of the object withinthe item under inspection. However, projection images are not wellsuited for reliably detecting objects that have at least one relativelythin dimension. If the thin dimension is parallel to the rays ofradiation passing through the item under inspection, the thin object,even if substantially more dense than other objects in the item underinspection will provide little overall attenuation to the rays passingthrough the item under inspection. Accordingly, there will be no groupof pixels in the image that has an attenuation significantly differentfrom other pixels in the image that can be recognized as a suspiciousregion.

To provide more accurate detection of relatively thin items, someinspection systems are constructed using computed tomography (CT). In aCT scanner, attenuation through an item under inspection is measuredfrom multiple different directions. Frequently, these measurements aremade by placing the x-ray source and detectors on a rotating gantry. Anitem under inspection passes through an opening in the center of thegantry. As the gantry rotates around the item, measurements are made onrays of radiation passing through the item from many differentdirections. These measurements can be used to compute the volumetricdensity, or other material property, of the item under inspection atmultiple points throughout a plane through which the rays pass. Such aprocess is commonly called “CT reconstruction.” Each of these computedvolumetric densities represents one data value of the image, frequentlycalled a “voxel,” in a slice through the item. By moving the item underinspection through the opening in the gantry and collecting image dataat multiple locations, voxels having values representative of multipleslices through the item may be collected. The voxels can be assembledinto a three dimensional, or volumetric, image of the item underinspection. Even relatively thin objects may form a recognizable groupof voxels in such a volumetric image.

In constructing an inspection system, projection imaging is desirablebecause projection images may be formed quickly and inexpensively withrelatively simply equipment. CT imaging is also desirable because someobjects, such as relatively thin objects, are more reliably detected involumetric images formed by a CT scanner. However, conventional CTscanners are frequently more expensive and slower than projectionscanners. Also, because a conventional CT scanner has more moving parts,it requires more frequent maintenance than a projection imaging system.

Attributes of both a projection imaging system and a CT imaging systemmay be combined. One example is the MVT™ imaging system sold by L-3Communications Security and Detection Systems, Inc., of Woburn, Mass.The MVT™ system employs multiple source-detector pairs. Each pair ispositioned to form a projection image of an item under inspection from adifferent angle than the others. The image data gathered by each of thesource-detector pairs is analyzed to detect suspicious regions in theimage representative of suspicious objects. Data from each image is alsoused together with data from the other images to facilitate suchdetection. For instance, data from one image that reveals the thicknessof an item can be used in conjunction with linear density measurementsreflected in another image to ascertain average volumetric densitymeasurements.

The MVT™ system, like other projection scanners, provides an advantageover a CT system of not requiring a moving source and detectors. Like aCT system, it provides an advantage over a projection imaging system ofbeing able to detect many thin objects. Though a contraband object mayhave a thin dimension parallel to the rays used to form one of theprojection images, a contraband object having any significant sizecannot have thin dimensions parallel to the rays used to form all of thex-ray projections. Accordingly, even though a contraband object may notbe readily recognizable from one of the projection images formed by theMVT™ system, such a contraband item is likely to be recognizable from atleast one of the other projection images.

Nonetheless, it would be desirable to improve the images formed in asystem like the MVT™.

SUMMARY

According to one aspect of the present invention, an apparatus comprisesa frame supporting at least first and second skewed radiation sourcesand at least first and second radiation detectors. The first and secondradiation detectors are substantially non-contiguous such that asubstantial gap exists between the first and second radiation detectorsthat is free of any radiation detectors. Each of the first and secondradiation detectors is also configured and arranged to detect radiationemitted by each of the first and second skewed radiation sources.

According to another aspect, a method involves moving an item underinspection in a first direction relative to and at least partiallybetween at least first and second skewed radiation sources and at leastfirst and second radiation detectors that are substantiallynon-contiguous such that a substantial gap exists between the first andsecond radiation detectors that is free of any radiation detectors.Radiation emitted by each of the first and second skewed radiationsources is detected with each of the first and second radiationdetectors.

According to another aspect, an apparatus comprises means for moving anitem under inspection in a first direction relative to and at leastpartially between at least first and second skewed radiation sources andat least first and second radiation detectors that are substantiallynon-contiguous such that a substantial gap exists between the first andsecond radiation detectors that is free of any radiation detectors; andmeans for operating the at least first and second skewed radiationsources and the at least first and second radiation detectors such thateach of the first and second radiation detectors detects radiationemitted by each of the first and second skewed radiation sources.

According to another aspect, a method for operating an inspection systeminvolves moving an item under inspection in a first direction relativeto and at least partially between at least one radiation source and atleast some radiation detectors illuminated by the at least one radiationsource. The radiation source and detectors are operated such that raypaths extending linearly between the at least one radiation source andat least some of the radiation detectors form acute angles with respectto a plane having a normal direction coinciding with the first directionthat are substantially in excess of three degrees. Data accumulated bythe radiation detectors is processed to form a three-dimensionaltomographic data image of at least a portion of the item underinspection.

According to another aspect, an inspection system comprises a frame, atleast one radiation source, radiation detectors, a conveyor, and aprocessor. The radiation source is supported by the frame and emits raysof radiation. The radiation detectors are supported by the frame and areconfigured and arranged to detect rays of radiation emitted by the atleast one radiation source. The conveyor is configured and arranged tomove an item under inspection in a first direction relative to the framesuch that at least a portion of the item under inspection passes betweenthe at least one radiation source and at least some of the radiationdetectors. The processor is configured to process data accumulated bythe radiation detectors to form a three-dimensional tomographic dataimage of at least a portion of the item under inspection. In addition,the radiation source and the radiation detectors are configured andarranged with respect to the conveyor such that ray paths extendinglinearly between the at least one radiation source and at least some ofthe radiation detectors form acute angles with respect to a plane havinga normal direction coinciding with the first direction that aresubstantially in excess of three degrees.

According to another aspect, a method involves accumulating transmissiondata for rays of radiation that are generated by at least one radiationsource and detected by a plurality of radiation detectors, andprocessing the transmission data to form a tomographic image, in which,for all possible orientations of a three dimensional plane, theorientation vectors of at least some of the rays of radiation for whichtransmission data was accumulated and used to form the tomographic imageform an angle of less than eighty-five degrees or greater than ninetyfive degrees with respect to the plane.

According to another aspect, the an inspection system comprises at leastone radiation source, a plurality of radiation detectors, and aprocessor. The radiation detectors are configured and arranged to detectrays of radiation that are generated by the radiation source. Theprocessor is configured to process transmission data based upon outputsof the plurality of radiation detectors to form a tomographic image, inwhich, for all possible orientations of a three dimensional plane, theorientation vectors of at least some of the rays of radiation for whichtransmission data was accumulated and used to form the tomographic imageform an angle of less than eighty-five degrees or greater than ninetyfive degrees with respect to the plane.

According to another aspect, a method comprises steps of: (a)determining an approximation, other than a multiple of a transpose, ofan inverse of a system matrix for an inspection system; (b) afterperforming the step (a), scanning an item under inspection to accumulatescan data for each of a plurality of rays through the item underinspection; (c) computing an initial estimate of a volumetric image ofthe item under the inspection by combining the determined approximationof the inverse of the system matrix and the scan data; and (d) employingan iterative process to refine the initial estimate of the volumetricimage to obtain a more accurate volumetric image corresponding to thescan data.

According to another aspect, an inspection system comprises means fordetermining an approximation, other than a multiple of a transpose, ofan inverse of a system matrix for an inspection system; at least oneradiation source and a plurality of radiation detectors configured andarranged to accumulate scan data for each of a plurality of rays throughthe item under inspection after the means for determining has determinedthe approximation of the inverse of the system matrix; means forcomputing an initial estimate of a volumetric image of the item underthe inspection by combining the determined approximation of the inverseof the system matrix and the scan data; and means for employing aniterative process to refine the initial estimate of the volumetric imageto obtain a more accurate volumetric image corresponding to the scandata.

According to another aspect, an inspection system comprises means formoving an item under inspection in a first direction relative to and atleast partially between at least one radiation source and at least someradiation detectors illuminated by the at least one radiation source;means for operating the at least one radiation source and the radiationdetectors such that ray paths extending linearly between the at leastone radiation source and at least some of the radiation detectors formacute angles with respect to a plane having a normal directioncoinciding with the first direction that are substantially in excess ofthree degrees; and means for processing data accumulated by theradiation detectors to form a three-dimensional tomographic data imageof at least a portion of the item under inspection.

According to another aspect, an inspection system comprises means foraccumulating transmission data for rays of radiation that are generatedby at least one radiation source and detected by a plurality ofradiation detectors; and means for processing the transmission data toform a tomographic image, in which, for all possible orientations of athree dimensional plane, the orientation vectors of at least some of therays of radiation for which transmission data was accumulated and usedto form the tomographic image form an angle of less than eighty-fivedegrees or greater than ninety five degrees with respect to the plane.

According to another aspect, a system comprises a cathode, a target, oneor more switches, and a conductive element. The cathode is configuredand arranged to generate an electron beam, and the target is configuredand arranged to emit radiation when electrons in the electron beamimpact the target after being accelerated by an energy source. The oneor more switches are configured and arranged to apply either a firstvoltage or a second voltage from a power supply between the cathode andthe target. The conductive element is disposed between the cathode andthe target so as to inhibit the electron beam generated by the cathodefrom reaching the target when a signal is applied to the conductiveelement.

According to another aspect, a method involves applying each of a firstvoltage and a second voltage between a cathode that generates anelectron beam and a target that emits radiation when electrons in theelectron beam impact the target after being accelerated by an energysource. In addition, a signal is applied to a conductive elementdisposed between the cathode and the target so as to inhibit theelectron beam generated by the cathode from reaching the target.

According to another aspect, a system comprises a cathode configured andarranged to generate an electron beam and a target configured andarranged to emit radiation when electrons in the electron beam impactthe target after being accelerated by an energy source. In addition, thesystem comprises means for applying either a first voltage or a secondvoltage between the cathode and the target, and means for inhibiting theelectron beam generated by the cathode from reaching the target.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a drawing of a security checkpoint employing an example of aninspection system that may embody various aspects of the invention;

FIG. 2 is a diagram illustrating an example of a technique for forming amultiview volumetric image;

FIG. 3 illustrates an example of a computation that may be performed inconnection with computing a volumetric image;

FIG. 4 illustrates another example of a computation that may beperformed in connection with computing a volumetric image;

FIG. 5 illustrates another example of a computation that may beperformed in connection with computing a volumetric image;

FIG. 6 is a flow chart illustrating an illustrative example of a processthat may be used to compute a volumetric image;

FIG. 7 is a flow chart illustrating another illustrative example of aprocess that may be used to compute a volumetric image;

FIGS. 8A, 8B, and 9A-E are drawings illustrating examples of variousconfigurations and techniques that may be used to make attenuationmeasurements of an item under inspection;

FIG. 10 is a drawing illustrating various components of an illustrativeexample of an inspection system;

FIG. 11A is a drawing illustrating, in more detail, a side-view of theinspection system shown in FIG. 10;

FIG. 11B is a drawing showing a cross-section of the inspection systemshown in FIG. 11A taken through the line A-A;

FIG. 11C is a drawing showing a cross-section of the inspection systemshown in FIG. 11A taken through the line B-B;

FIG. 11D is a drawing showing a cross-section of the inspection systemshown in FIG. 11A taken through the line C-C;

FIG. 12 is a schematic drawing showing various dimensions of theinspection system shown in FIGS. 10 and 11;

FIGS. 13 and 14 are drawings illustration how detector banks suitablefor use in the example embodiment described in connection with FIGS.10-12 may be configured;

FIG. 15 is a schematic diagram of an example of a system employing apair of gridded dual energy x-ray tubes to illuminate a common detectorarray; and

FIGS. 16 and 17 are timing diagrams illustrating examples of variouswaveforms that may appear in the system shown in FIG. 15.

DETAILED DESCRIPTION

FIG. 1 illustrates a security checkpoint 100 at which an inspectionsystem according to various embodiments of the invention may beemployed. The checkpoint 100 may, for example, be a checkpoint used atany facility at which it is desired to create a secured area. Forinstance, at an airport, the checkpoint 100 may be located at theentrance to boarding gates and used to inspect passenger carry onluggage. Alternatively, the checkpoint 100 may be positioned at anairport to inspect checked baggage before it is loaded on airplanes.Inspection systems according to embodiments of the invention are notlimited to use at airports, however; the checkpoint 100 may be acheckpoint located in any suitable setting.

In the example shown, the checkpoint 100 includes an inspection system110. As described in greater detail below, the inspection system 110 mayproduce volumetric images of items under inspection. In the example ofFIG. 1, an item under inspection 130 is pictured as a suitcase. However,the inspection system 110 may operate on any suitable type of item underinspection, such as other forms of luggage, carry on items, parcels orany other container in which contraband objects may be concealed. Insome embodiments, the inspection system 110 may even be large enough toexamine the contents of cargo containers, cars, trucks, ocean goingvessels, etc.

In the embodiment shown, the inspection system 110 includes a conveyor120. Items under inspection 130 may be placed on the conveyor 120 andmoved through a tunnel 122. In alternative embodiments, the x-raysources and detectors may be moved along the length of an item underinspection while the item remains stationary, or both the item and thesources and detectors may be moved relative to one another during theinspection process. All that is important is that the item underinspection and the source/detector combinations somehow move relative toone another so as to allow the item to be imaged. Within the tunnel 122,x-ray sources (not shown in FIG. 1) are positioned to direct radiationat items on the conveyor 120. Detector arrays (also not shown in FIG. 1)are positioned to receive radiation from the x-ray sources after theradiation has passed through an item under inspection.

Data output from the detectors can be used to form an image of the itemunder inspection which may then be analyzed. For example, outputs of thedetector arrays may be passed to a computer 112, which may process theoutputs of the detectors to form a volumetric image of each item underinspection. Each such volumetric image may then be analyzed to detectsuspicious regions within the image.

Image analysis may, for example, be performed by displaying a visualrepresentation of the image for examination by a human operator 114.Additionally or alternatively, the computer 112 may process thevolumetric images using automatic detection algorithms to identifysuspicious regions. Once suspicious regions are identified by computerprocessing, those regions may be highlighted in a visual image displayedfor the human operator 114.

In the embodiment illustrated, the computer 112 is shown as a desktopcomputer workstation located at the checkpoint 100. However, the typeand location of the computer 112 is not a limitation on the invention.For example, the computer 112 may alternatively be integrated into thechassis of the inspection system 110, or may be connected to theinspection system 110 over a network link. If the computer 112 isconnected over a network link, it may be located at any suitablelocation reachable by the network and does not need to be physicallylocated at the checkpoint 100. Further, although the computer 112 isshown as a single computer, it should be appreciated that a collectionof one or more computers may alternatively be used to process datacollected by the inspection system 110. If processing is performed bymultiple computers, it is not necessary that the computers be locatedtogether. Accordingly, the computer 112 should be understood torepresent one or more computer processors located in any suitablelocation or locations that may perform processing on the data collectedby the inspection system 110.

FIG. 2 is an illustration demonstrating how a volumetric density imagemay be computed from measurements made on an item under inspection 130by an inspection system such as that shown in FIG. 1. In the simpleexample of FIG. 2, the item under inspection 130 is divided intotwenty-seven regions. An image of the item under inspection 130 may beformed by computing a property of the material in each of thesetwenty-seven regions. Each of the twenty-seven regions will correspondto a voxel in the computed image. For this reason the regions in theitem under inspection are sometimes also referred to as “voxels.” In thesimple example of FIG. 2, the item under inspection 130 is divided intotwenty-seven voxels of which voxels V(1,1,1), V(1,1,2), V(1,1,3),V(2,2,3) and V(3,3,3) are numbered. To form an image of the item underinspection 130, a material property may be computed for each of thevoxels from the measured outputs of detectors. In the illustratedembodiment, the material property is the volumetric density of thematerial within each voxel.

In the example shown, measurements from which the volumetric densitiesof the respective voxels may be computed are made by passing rays ofradiation through the item under inspection 130 from differentdirections. By using detectors 230 ₁, 230 ₂, 230 ₃ to measure theintensity of the rays after they have passed through the item underinspection and comparing the measured intensity to a known incidentintensity, attenuation measurements (e.g., D₁, D₂, and D₃ in FIG. 2) maybe made. For example, each attenuation measurement D_(i) for acorresponding ray may be calculated according to the following equation:D _(i)=−ln(INT _(measured) /INT _(incident)).

In this equation, INT_(measured) represent the intensity of the i^(th)ray measured by a corresponding detector, and INT_(incident) representsthe intensity the incident ray before it was intercepted the item underinspection, which is a known value. When attenuation measurements D_(i)are made along a sufficient number of rays traveling in a sufficientnumber of directions, the data collected can be processed to compute thevolumetric density within each of the voxels individually.

Processing may be performed, for example, by treating each attenuationmeasurement D_(i) as defining one equation of a system of simultaneousequations in which the volumetric densities of the voxels are unknowns.Computing the image may thus involve solving the system of simultaneousequations for the unknown values of the volumetric voxel densities.

For example, FIG. 2 shows a source 220 ₁, and a detector 230 ₁. A raytraveling from the source 220 ₁ to the detector 230 ₁ passes throughvoxels V(1,1,3), V(2,2,3) and V(3,3,3). As a result, the attenuationmeasurement D₁ that is determined based on the output from the detector230 ₁ will depend on the volumetric densities of each of those threevoxels. That attenuation measurement D₁ may be expressed as an equation:D ₁ =m ₁ I(1,1,3)+m ₂ I(2,2,3)+m ₃ I(3,3,3).

In this equation, I(1,1,3) represents the volumetric density withinvoxel (1,1,3). Similarly, each of the other values express as a functionof I( ) represents the volumetric density within a corresponding voxel.

Each of the quantities m₁, m₂ and m₃ represents a weighting factorindicating the manner and amount that the corresponding voxel influencesthe attenuation measurement D₁ made by the detector 230 ₁. Eachweighting factor may represent many parameters of the inspection system.For example, for voxels that fall along a ray between the source 220 ₁and the detector 230 ₁ that leaves the source 220 ₁ at an angle in whichthe source 220 ₁ emits a relatively low amount of radiation, theweighting factors may be relatively small to account for the fact thatthe quantity D₁ will have a disproportionately small value for thatreason. Another parameter that may be reflected in a weighting factor isthe percentage of the path between a source and a detector that isoccupied by a corresponding voxel. For example, if a ray between thesource 220 ₁ and the detector 230 ₁ passes through all of the voxelV(1,1,3) but only through a corner of the voxel V(2,2,3), the volumetricdensity of the voxel V(1,1,3) would have a greater impact on theattenuation measurement D₁ determined by the detector 230 ₁ than wouldthe volumetric density of the voxel (2,2,3). To reflect this differencein impact, the weighting factor m₁ may be made larger than the weightingfactor m₂. The weighting factors may also reflect the appropriateconversion between attenuation and volumetric density.

In the example of FIG. 2, a ray from the source 220 ₁ to the detector230 ₁ represents just one of the rays passing through the item underinspection 200. Other rays are also depicted. For example, a ray isshown passing from the source 220 ₂ to the detector 230 ₂. As with theray passing from the source 220 ₁ to the detector 230 ₁, an equation canbe written representing the attenuation measurement D₂ as determinedfrom the output of the detector 230 ₂. In this case, the ray from thesource 220 ₂ to the detector 230 ₂ passes through the voxels V(1,1,3),V(2,2,3) and V(3,2,3). Accordingly, the equation for the attenuationmeasurement D₂ is given by:D ₂ =m ₄ I(1,1,3)+m ₅ I(2,2,3)+m ₆ I(3,2,3)

The equation for the attenuation measurement D₂ is thus in the same formas the equation for the attenuation measurement D₁. However, theequation expresses a relationship between volumetric density values fordifferent voxels, and also uses different weighting factors than thosethat are used to describe the attenuation measurement D₁. Specifically,the equation describing the attenuation measurement D₂ uses volumetricdensity values I(1,1,3) I(2,2,3), and I(3,2,3) for voxels V(1,1,3),V(2,2,3) and V(3,2,3), and weighting factors m₄, m₅ and m₆.

A similar equation can be written representing the attenuationmeasurement D₃ as determined from the output of the detector 230 ₃. Inthe illustrated embodiment, the attenuation measurement D₃ depends onthe amount that a ray passing from the source 220 ₃ to the detector 230₃ is influenced by the volumetric densities of the voxels along thatray, as well as the weighting factors representative of parameters ofthe inspection system. Such an equation, though in the same form asequations for D₁ and D₂, will include volumetric density values fordifferent voxels and may contain different weighting factors.

FIG. 2 shows only three rays passing through the item under inspection130. Each of the rays generates one equation containing as unknownsvalues representative of the volumetric densities of a particular set ofvoxels in the item under inspection 130. From basic linear algebra, itis known that a system of equations may be solved if the number ofindependent equations equals or exceeds the number of unknowns. In thesimple problem illustrated in FIG. 2, the item under inspection 130 isdivided into twenty-seven voxels. Accordingly, at least twenty-sevenindependent equations are required to solve for the volumetric densityin each of those twenty-seven voxels. Accordingly, though FIG. 2 showsonly three rays passing through the item under inspection 130, tocompute a volumetric image of the item under inspection 130,measurements on at least twenty-seven rays passing through the itemunder inspection 130 from different angles would be needed.

If a sufficient number of attenuation measurements D_(i) along rays froma sufficient number of independent angles are made, the measured outputsof the detectors may be used to define a system of simultaneousequations that may be solved for the unknown values representing thevolumetric densities of the individual voxels in the item underinspection 130. Such a system of simultaneous equations may berepresented by a matrix equation in the form:I*M=D

In this equation, “I” represents a vector containing the unknown valuesof the volumetric densities of the voxels, which needs to be computed toform an image of the item under inspection 130. In the example of FIG.2, in which twenty-seven voxels are shown, the vector I will havetwenty-seven entries. However, FIG. 2 represents a simplified exampleand, in a practical system, the vector I may have many more thantwenty-seven entries.

The value “M” in the above equation is a matrix representing thecollection of the weighting factors m₁, m₂ . . . . Because the values ofthe weighting factors are determined by parameters of the system, suchas the position and operating characteristics of the sources anddetectors used to take the various measurements, these values may bedetermined. The values in the matrix M may be computed based upon knownproperties of the inspection system 110 or may be determinedempirically. As one example, the weighting factors may be determinedempirically, for example, by taking measurements using the system withone or more items having known properties.

The quantity “D” represents a vector containing the attenuationmeasurements as determined using the outputs of respective detectors.The value of D is thus also known after an item has been scanned by thesystem 110.

Accordingly, the image I may be computed by solving the above equation.Conceptually, the vector I may be computed by multiplying both sides ofthe equation by the inverse of the matrix M. This operation isrepresented by the equation:I=D*M ⁻¹

For an inspection system, such as the inspection system 110, thisequation indicates that the image vector I of item under inspection 130may be computed by multiplying a vector containing attenuationmeasurements as determined using the outputs of multiple detectors bythe inverse of a matrix M containing values characterizing themeasurement system.

In a physical system, the number of measurements taken will likelyexceed the number of voxels in the image. Uncertainty or othervariations in the measurement process may prevent a single solution fromsatisfying simultaneously all equations in a system of equations formedfrom the measurements. Thus, solving the system of equations formed fromactual measurements may involve finding the values that best solve theequations.

With respect to the above discussion, it should be appreciated that, inlieu of the attenuation measurements D_(i), other measured values, suchas linear density measurements, or even simply detector output valuesrepresenting the measured intensities of respective rays, mayalternatively be used in the above equations provided that the weightingfactors in the system matrix M are appropriately adjusted to account forsuch a substitution.

FIG. 3 illustrates an example of an algebraic reconstruction technique(ART) which may be employed as a direct method of computing a value ρfor each of the voxels in the item under inspection. The illustratedequations and technique are explained in more detail in M. Goitein,“Three Dimensional Density Ronstructions from a Series ofTwo-Dimensional Projections,” Nuclear Instruments and Methods, Volume101, pp. 509-158 (1979), which is incorporated herein by reference inits entirety. Additional details concerning possible implementations ofsuch a technique are also described in U.S. Pat. Nos. 5,442,672 and6,236,709, each of which is incorporated herein by reference in itsentirety. The process of FIG. 3 illustrates that a maximum likelihoodestimate, represented as M², may be computed. In the equation, X_(i) isa function of the voxel densities yielding an estimate of valuesmeasured along the i^(th) ray. By subtracting this estimate from theactual measured value χ_(i), an error value is obtained. When theseerror values are weighted by an uncertainty value σ_(i), squared andsummed with similarly computed values along other rays, a value of M²results. Density values can be computed that minimize the changes in M²with respect to changes in density values. Density values that satisfythis criteria represent the computed image.

Solving an equation of linear algebra through use of an inversetechnique is sometimes referred to as a “direct” method of computing theimage. While computing the image vector I by a direct method wouldinvolve a relatively straight forward application of linear algebratechniques, direct methods have not been used in practice. One reasondeterring the use of direct methods is that the system matrix Mtypically varies with time. Noise, electronic drift and other variablesmay alter the weighting factors that define the system matrix M. Afurther deterrent to the use of direct methods is the amount ofcomputation involved in computing the inverse of matrix M. The imagevector I may have thousands, or tens of thousands, of entries. Thesystem matrix M will have a number of entries that is proportional tothe square of the number of entries in the image vector I and thereforemay have billions of entries. Even if the matrix M can be readilydetermined, using an inverse technique is a computationally difficulttask that prevents the direct method from being used in a practicalinspection system in which items must be cleared or alarmed within afinite, and usually very short, period of time.

FIG. 4 represents an alternative approach to finding values thatmaximize the likelihood that an image vector solves a system ofequations developed from measurements of radiation passing through anitem under inspection. The equations and approach illustrated in thisfigure are explained in more detail in M. Goitein, “Three DimensionalDensity Ronstructions from a Series of Two-Dimensional Projections,”Nuclear Instruments and Methods, Volume 101, pp. 509-158 (1979),incorporated by reference above. This approach may be used, for example,for computing volumetric density values that form an image of the itemunder inspection. In the approach of FIG. 4, the equations defining therelationship between the attenuation measurements and the volumetricdensity values of the voxels of the items under inspection are solvediteratively.

The iterative solution starts with an initial guess of the vectorrepresenting the volumetric densities of the voxels. In the example ofFIG. 4, a constant density in each voxel is used as an initial estimateof the image vector. Thereafter, values of the densities in each of thevoxels are computed iteratively by finding values that maximize thelikelihood that the computed density values correctly solve the systemof equations derived from the attenuation measurements determined by thedetectors. At each iteration, a discrepancy of the estimated value ofthe vector ρ is computed. This discrepancy is depicted in FIG. 4 by thequantity Δρ_(i).

The discrepancy vector Δρ may be used to compute the estimated value ofρ for the next iteration, which in FIG. 5 is denoted ρ′. As shown inFIG. 5, the value of ρ′ is computed as the sum of ρ, the prior estimateof the density vector, plus the discrepancy value Δρ multiplied by arelaxation value λ.

Using a relaxation value λ prevents the iterative computation fromdiverging or oscillating. A relaxation value λ may be selected in anysuitable way. FIG. 5 shows an example of a suitable equation forcomputing λ.

Turning to FIG. 6 an alternative embodiment of an iterative process forcomputing the image vector of an item under inspection is shown. Asshown, the process may contain two subprocesses, an off-line subprocess750 and inspection subprocess 760. The subprocess 750 may be performed“off line,” meaning that it can be performed when the inspection systemis not actively being used to inspect items. The offline subprocess 750may, for example, be performed as part of the manufacture of theinspection system. Alternatively, it may be performed as part of theinstallation of the inspection system or may be performed on a routineor periodic basis as part of a calibration or maintenance routine forthe system. Accordingly, the specific time at which offline subprocess750 is performed is not a limitation of the invention.

Regardless of when the off line subprocess 750 is performed,measurements taken during the subprocess 750 may be used to compute aclose approximation of the inverse of system matrix M. As shown in FIG.6, the off line subprocess 750 may begin at a step 710, whereattenuation measurements D_(i) may be made based upon detector outputvalues without an item under inspection present. Computation to thesystem matrix M may then be performed at a step 711. Any suitablecomputational approach may be used to determine the system matrix M. Thecomputation at the step 711 may, for example, be based in whole or inpart on the measurements taken at the step 710. Computation may alsoinvolve, in whole or in part, computations based on the design of thesystem. If computation of the system matrix M is based entirely on thedesign of the system, then the measurements at the step 710 would not berequired.

Regardless of how values are obtained to form the system matrix M, atthe step 712, the approximation of the inverse of the system matrix Mmay be computed. Any suitable method may be used to compute the inversematrix M⁻¹. In some embodiments, for example, the inverse matrix M⁻¹ maybe computed in a computer data processor. As one example, the inversematrix M⁻¹ may be computed by decomposing the matrix M into an upper andlower triangular matrix and then backsubstituting the unit vectors.However, any suitable processing approach may be used.

Regardless of how the approximation of the inverse of the system matrixis computed at the step 712, processing proceeds to a step 714. Theprocessing at the step 714 begins the subprocess 760 (mentioned above),which may be performed for each item under inspection. At the step 714,attenuation measurements D_(i) may be made on the item under inspection.As described above in connection with FIG. 2, such measurements may bemade along a sufficient number of rays passing through the item underinspection from a sufficient number of angles to generate a system ofequations that can be solved for the image values at each of the voxelsin the item under inspection. In the illustrated embodiments, each imagevalue represents the volumetric density of the item under inspection ina particular voxel.

Once attenuation measurements D_(i) are collected, processing mayproceed to a step 716 where an initial estimate of the image vector Imay be computed. At the step 716, the approximated inverse of the systemmatrix M⁻¹ that was computed during the off line process 750 may beapplied to the measured attenuation values D_(i) to provide an initialestimate of the image vector I. Because the approximation of the inverseof the system matrix M may be computed as part of the offline subprocess750, a time-consuming direct technique to compute the initial estimateof the image vector I can be employed without adversely impacting theon-line throughput of the system. Further, because the result ofapplying the approximated system matrix inverse M⁻¹ is only an initialestimate of the image vector I, any imprecision introduced by variationsin the inspection system after the system matrix M has been computedwould not necessarily impact the final result. Because the initialestimate is likely to be a close approximation to the actual imagevalues, however, the iterative processing based on that initial estimateof the image vector I may require a relatively small number ofiterations to converge to an acceptable solution. Accordingly, with suchan initial estimate, the iterative processing in the subprocess 760 mayquickly produce an accurate result.

At a step 718 of the on-line subprocess 760, an estimate of the error inthe estimated image vector I may be determined. Any suitable approachfor computing the error in the estimate may be used for this purpose,and the invention is not limited to the use of any particular techniqueor approach. In some embodiments, for example, an error may be computedby comparing a “forward projection” of the estimated image vector I toactual attenuation measurements. The forward projection is a computationof the attenuation measurements D_(i) that would result if the itemunder inspection had the material characteristics indicated by theestimated image vector I.

Once the initial estimate is computed, processing may proceed to a step720, where the estimated image vector I may be updated. Any suitablecomputational technique for iteratively solving a system of equationsmay be used to update the estimate at the step 720. In some embodiments,for example, the computed error may be used to compute an adjustment tothe image vector I that should cause the forward projection to moreclosely match the actual attenuation measurements D_(i). The amount ofthe adjustment may, for example, be proportional or otherwise related tothe error.

At a decision step 722, the process branches depending on whether thecomputation has converged to an acceptable solution. Any suitable methodmay be used to determine whether the computation of the image vector Ihas converged. For example, the process may be deemed to have convergedif the computed error is below a threshold. Alternatively, convergencemay be determined based on the magnitude or percentage change from oneiteration to the next.

If it is determined that the processing has not converged, the processloops back to the step 718 where the error in the estimate of the imagevector I may again be computed. Processing at the steps 718, 720 and 722may thus be repeated until it is determined that the updated estimaterepresents an acceptable solution. When it is determined at the decisionstep 722 that the iterative computation in the subprocess 760 hasconverged to an acceptable solution, the process may terminate, with themost recent estimate of the image vector I representing the computedimage vector I. The image vector I may thereafter be used to alarm orclear the item under inspection, or used for any other desired purpose.

The on-line subprocess 760 may involve any suitable computationalmethod. FIG. 7 illustrates, in greater detail, an example of onepossible implementation. In particular, FIG. 7 is a flow chart of anexample of a process for computing image values using volume iteration.As shown, the process begins at a step 310 where an initial estimate ofthe image vector I is formed. In FIG. 7, the initial estimate isrepresented by the value {right arrow over (I_(o))}. In the exampleshown, the initial estimate {right arrow over (I_(o))} is computed bymultiplying the vector {right arrow over (D)}, representing the vectorof attenuation measurement D_(i) as determined by outputs of thedetectors, by the inverse of a system matrix M. The system matrix Mmaybe the same as described in connection with FIG. 2 and may representparameters of the inspection system. However, because the value of theinverse matrix M⁻¹ is used only for the computation of an initialestimate, an approximation to the inverse of the current system matrixmay instead be used. The inverse matrix M⁻¹ may be an approximationeither because the values used to form the matrix M are estimates orbecause the inverse of the matrix M is estimated.

Once the initial estimate of the image vector is determined, aniterative process may be performed to update the initial estimate of theimage vector to more accurately match the measured values. Any suitableiterative technique may be used to update the estimate of the imagevector, and the invention is not limited to any particular method ortechnique. The process is shown in FIG. 7 is just one example of asuitable technique.

The process continues to step 312 where a forward projected value {rightarrow over (d)} may be computed. As shown, the forward projected value{right arrow over (d)} may be, for example, be computed by multiplyingthe estimated image vector {right arrow over (I_(o))} by the systemmatrix M.

At a step 314, the difference between the actual attenuationmeasurements D_(i) and the forward projected values may be computed.That computation is represented in FIG. 7 by the vector subtraction{right arrow over (D)}-{right arrow over (d)}.

At a step 316, a first image offset component, denoted I′, may becomputed. As shown, the image offset I′ may, for example, be computed bymultiplying the difference ({right arrow over (D)}-{right arrow over(d)}) by the transpose of the system matrix, M^(T), and that product maybe scaled by a value ε, which acts as a relaxation parameter.

At a step 318, a second difference image component I″, may be computed,for example, using a regulator matrix H. The regulator matrix H may beselected using conventional numeric processing methods or in any othersuitable way. The value of I″ may, for example, be the maximum of (1)the product of the regulator matrix H and the estimate of the imagevector I scaled by both the relaxation parameter ε and the parameter λ,which controls the degree of regulation, and (2) the sum of theestimated image and the difference image I′. In the example shown, bothof these values are negated, which should result in positive values, andthe larger of the two is selected as the second difference imagecomponent I″, which for the j^(th) iteration is represented by I_(j)″.

The process continues to a decision step 320. At the decision step 320,the process branches based on whether the sum of the difference imagesI′ and I″ is small enough. In this context, what value is “small enough”may be determined in any suitable way. For example, an absolute numericvalue may be computed in advance to represent an acceptable level ofuncertainty in the values of the computed image. If the sum of thedifference images I′ and I″ is less than the acceptable level ofuncertainty, the sum may be accepted as small enough. Alternatively, thenumeric value corresponding to values that are small enough may bedetermined dynamically, as a percentage of the value of the estimatedimage I, or in any other suitable way.

Regardless of how a specific value is determined, if the sum of thedifference images I′ and I″ is less than that value, the process of FIG.7 may be deemed to have converged. If the computation has converged, theprocess branches to a termination point 324 where the process ends withthe last estimate of image vector I being used as the computed imagevector. However, if the process has not converged, based on thedetermination made at the decision step 320, the process branches to astep 322. At the step 322, the estimate of the image vector I is updatedby adding the difference images I′ and I″ to it. This updated estimateof the image vector I is then used for a further iteration in theprocess. Accordingly, FIG. 7 shows the process branching back to thestep 312, where the process of computing a further iteration of theimage vector I is repeated.

As described in connection with FIG. 2, computing an image vector I fromthe measured outputs of detectors in an inspection system requires thatthe detectors measure attenuation along multiple rays passing throughthe item under inspection from multiple angles. In the embodiment ofFIG. 2, for simplicity of illustration, each detector was shownreceiving a ray emanating from a separate source. In constructing aninspection system, it is desirable to reduce the number of both sourcesand detectors used. Accordingly, radiation sources and detectors may bepositioned so that multiple detectors receive rays from the same source.

FIG. 8A illustrates an example of a detector array 830 containingdetectors 830 ₁, 830 ₂ . . . 830 ₇. The detector array 830 may, forexample, be positioned on the opposite side of a tunnel (e.g., thetunnel 122 in FIG. 1) as the source 820. As shown, the source 820 may becollimated to emit radiation in a beam 802 containing multiple rays thatimpinge upon the detector array 830. Accordingly, measuring the outputsof each of the detectors 830 ₁, 830 ₂ . . . 830 ₇ while the source 820is emitting radiation allows attenuation measurements D_(i) to be madefor multiple rays that intersect the portion of the item underinspection 130 through which the beam 802 passes.

FIG. 8B illustrates how motion of a conveyor 120 may allow additionalattenuation measurements D_(i) to be made along different rays throughthe item under inspection 130 without moving the source 820 or detectorarray 830. In FIG. 8A, when the item under inspection 130 was in a firstposition 800 at a first time, the source 120 and the detector array 130allowed a first set of attenuation measurement D_(i) to be made for afirst set of rays that intersected a first portion of the item underinspection at the first time. As shown in FIG. 8B, the source 820 anddetector array 830 may be kept in the same position as in FIG. 8A, butthe conveyor 120 may move the item under inspection 130 from the firstposition 800 to a second position 800′ relative to those components.Accordingly, when the item under inspection 130 is in the secondposition 800′ at a second time, the source 120 and detector array 130can make a second set of attenuation measurements D_(i) for a second setof rays that intersect a second portion of the item under inspection 130at the second time. In this manner, the same source 120 and detectorarray 130 pair can be used to make discrete attenuation measurements formultiple rays through the item under inspection 130 at multiple times asthe item under inspection 130 is moved relative to them.

In an inspection system, a single source and a corresponding detectorarray may be used to make attenuation measurements D_(i) for rayspassing through the item under inspection over a range of angles. Forexample, the configuration illustrated in FIGS. 8A and 8B would becapable of making attenuation measurements for rays passing through theitem under inspection over a range of angles of approximately 45°. Foraccurate reconstruction, it may be desirable to have rays passingthrough the item under inspection from a range of angles that exceeds180°, or an angle that is as close to 180° as possible. FIGS. 9A-Eillustrate source and detector arrangements that may be used to increasethe angular range of the rays for which attenuations measurements may bemade on an item under inspection.

As shown in FIG. 9A, a detector array 930 ₁ may have segments that spanmultiple sides of a tunnel 122. In the example shown, the detector array930 ₁ is an L-shaped array. By using an L-shaped array, or similar arraythat covers a greater angular extent of the tunnel 122, the angularrange over which measurements can be made can be increased withoutincreasing the number of sources. In various embodiments, any or all ofthe detector arrays in an inspection system may employ such aconfiguration.

FIG. 9A also illustrates that range of angles through which attenuationmeasurements may be made can be increased without increasing the numberof detector arrays by positioning multiple sources to emit radiationtowards the same detector array. In the illustrated example, two sources920 ₁ and 920 ₂ are both positioned to emit respective beams ofradiation towards the detector array 930 ₁. As shown, the sources 920 ₁and 920 ₂ may be “skewed,” meaning that each source is configured andarranged so as to emit a beam of radiation towards the detector array930 ₁ over a different range of angles than the other. By controllingthe sources 920 ₁ and 920 ₂ so that they to emit their beams ofradiation toward the detector array 930 ₁ at different times, thedetector array 930 ₁ can be used to make attenuation measurements basedon the rays received from each such source.

In various embodiments, any or all of the detector arrays in the systemmay be illuminated by two or more skewed sources in this manner. In someembodiments, two or more sources that emit radiation toward a commondetector array may be skewed with respect to one another and may also belocated in substantially the same plane (perpendicular to the directionof travel of the conveyor) as the detector array. In other embodiments,one or more of such skewed sources may be located in a substantiallydifferent plane than the common detector array. In some embodiments, oneor more of the sources may be positioned so that rays between the sourceand at least some of the detectors in the array form an angle withrespect to the plane in which the detector array is disposed(perpendicular to the direction of travel of the conveyor) that issubstantially in excess of three degrees, or substantially in excess offive degrees, or substantially in excess of ten degrees, orsubstantially in excess of twenty degrees, or substantially in excess ofthirty degrees.

As explained below in more detail, any number of detector arrays, suchas the detector array 930 ₁, may be included in an inspection system,and each such detector array can be used to detect radiation frommultiple sources that emit radiation during distinct time intervals.Each attenuation measurement made by the detectors in each such detectorarray during the respective time intervals corresponds to an attenuationmeasurement for a different ray through the item under inspection 130.The collection of the attenuation measurements for any or all of suchrays may be used to determine a volumetric image of the item underinspection using the techniques discussed above or otherwise.

FIG. 9B illustrates an alternative way in which the number ofattenuation measurements may be increased. In the example shown,multiple sources 920 ₁ and 920 ₂ are positioned to irradiate an L-shapeddetector array 930 ₂. The detector array 930 ₂ differs from the detectorarray 930 ₁ (FIG. 9A) in that the detector array 930 ₂ includes multiplerows of detectors. In various embodiments, any or all of the detectorarrays in an inspection system may employ a such a multi-rowconfiguration. In the illustrated example, three rows of detectors areshown. It should be appreciated, however, that any suitable number ofrows of detectors may be incorporated in a detector array. In such aconfiguration, each row of detectors will have a different angularposition relative to each of the sources 920 ₁ and 920 ₂. Accordingly,rays from the sources 920 ₁ and 920 ₂ reaching each row of the detectorarray 930 ₂ will pass through different voxels of an item underinspection and represent a different measurement. In addition, althoughthe respective rows of detectors in the example shown are illustrated asbeing disposed directly adjacent one another in the array, it should beappreciated that the rows may alternatively be separated from oneanother by an appropriate distance. Such a configuration may bedesirable, for example, to minimize motion artifacts.

FIG. 9C shows another possible technique to increase the number ofmeasurements on an item under inspection. In this example, two L-shapeddetector arrays 930 ₃ and 930 ₄ are provided, and sources 920 ₃ and 920₄ are positioned opposite the detector arrays 930 ₃ and 930 ₄,respectively, so as to illuminate those arrays. As shown, the L-shapeddetector arrays 930 ₃ and 930 ₄ may be positioned on opposite sides ofthe tunnel 122 so that the rays emitted by the two sources 920 ₃ and 920₄ will intercept the item under inspection from opposite sides.Accordingly, rays passing from the sources to the detectors pass throughan item under inspection within the tunnel 122 from significantlydifferent angles. The range of angles collectively spanned by the raysbetween the source 920 ₃ and the detector array 930 ₃ and the source 920₄ and the detector array 930 ₄ will be about twice the range of anglesspanned by rays from a single source to a single detector array. Itshould be appreciated that other sources and/or detectors mayadditionally or alternatively be positioned at different locations aboutthe tunnel so as to provide additional or different angular coverage.

FIG. 9D shows yet another possible technique that may be employed toincrease the range of angles spanned by rays passing through the itemunder inspection. In this example, a detector array 930 ₅ is formed withsegments that span a larger amount of the periphery of the tunnel 122than a corresponding detector array 930 ₆. In the embodiment of FIG. 9D,the detector array 930 ₅ is C-shaped. In various embodiments, any or allof the detector arrays in an inspection system may employ such aconfiguration.

FIG. 9E illustrates yet another example of a technique that may beemployed to increase the range of angles spanned by rays passing throughthe item under inspection. This example is essentially a combination ofthe techniques discussed above in connection with FIGS. 9B and 9C. Inparticular, in the example shown, two multi-row detector arrays 930 ₇and 930 ₈ are positioned on opposite sides of the tunnel 122, with thedetector array 930 ₈ being illuminated by a first pair of skewed sources920 ₅ and 920 ₆, and the detector array 930 ₈ being illuminated by asecond pair of skewed sources 920 ₇ and 920 ₈.

The approaches illustrated in FIGS. 9A-E may be used separately ortogether. In addition, it should be appreciated that any or all of theapproaches described in connection with FIGS. 9A-E, and elsewhereherein, may be combined with the approach discussed above in connectionwith FIGS. 8A-B, so that discrete measurements may be taken from therespective detectors at many different times as a conveyor 120 moves anitem under inspection 130 through an inspection system 110.

In some embodiments, multiple detector arrays are employed. For example,four L-shaped detector arrays may be used, with each L-shaped arrayhaving a vertex positioned along one of four edges of the tunnel 122.Such detector arrays may have multiple rows of detectors. For example,each detector array may have “12” rows of detectors. Further, eachdetector array may have associated with it multiple sources. Forexample, each of the four detector arrays may have two sourcesassociated with it.

FIG. 10 shows a perspective view of various components of anillustrative example of an inspection system that may embody certaininventive features disclosed herein. FIGS. 11A-D illustrate in moredetail how the various components shown in FIG. 10 may be configured andarranged. FIG. 11A is a side view of the example system. FIGS. 11B, 11C,and 11D are cross-sectional views taken through sections A-A, B-B, andC-C, respectively, of FIG. 11A. The described inspection system may, forexample, make attenuation measurements D_(i) that may be used to obtaina volumetric density image I of an item under inspection, as describedabove.

In the example shown in FIGS. 10 and 11, the inspection system comprisesfour distinct radiation sources 1002, 1004, 1006, 1008. As shown, afirst pair of skewed radiation sources 1002, 1004 is positioned so as toilluminate a first bank of detectors 1110, and a second pair of skewedradiation sources 1006, 1008 is positioned so as to illuminate a secondbank of detectors 1112. In this example, each of the detector banks1110, 1112 comprises twelve separate rows of detectors. One such row isidentified in FIG. 10 with the reference numeral 1114. It should beappreciated that each row of detectors may itself comprise hundreds ofdetectors, each capable of making an attenuation measurement for aparticular ray passing through the item under inspection. Although shownonly for the source 1002 in FIG. 10, each of the sources 1002, 1004,1006, 1008 may have associated with it a respective collimator 1116.Each such collimator may be configured and arranged to collimate thex-rays or other form of radiation generated by its associated sourceinto a number of fan beams equal to the number of detector rows itilluminates. Thus, in the example embodiment shown, each collimatorforms twelve fan beams, with each such beam being directed toward arespective row of detectors, e.g., row 1114.

In the example shown, the banks of detectors 1110, 1112 are offset fromone another along the length of the tunnel 122. Since each of the foursources 1002, 1004, 1006, 1008 is capable of taking “12” skewedtomographic views in this example, a total of “48” skewed tomographicviews may be taken of an item under inspection for every position of theconveyor at which attenuation measurements are made. When single energymeasurements are made, two samples may be taken at each conveyorposition, one for each of the two sources associated with each detectorarray. When dual-energy measurements are taken, four samples may betaken at each conveyor position, with both a high-energy and a lowenergy sample being taken for each of the two sources associated witheach detector array. Known techniques may be employed to compensate forthe motion of the conveyor between the taking of groups of samples thatare intended to be for the same conveyor position.

FIG. 12 shows in greater detail how the sources 1002, 1004, 1006, 1008and detector banks 1110, 1112 may be positioned with respect to oneanother within a frame envelope 1200 of the inspection system, and therange of angles over which each source 1002, 1004, 1006, and 1008 mayprovide rays illuminating its associated detector bank. In FIG. 12, thelinear measurements in brackets are in millimeters and those not inbrackets are in inches.

FIGS. 13 and 14 illustrate an example of how detector banks suitable foruse in a system such as that described above may be configured. As shownin FIG. 13, several individual scintillator/detector boards 1302 may bemounted on a motherboard 1304. The motherboard 1304, in turn, may besecured to an alignment frame 1306, thus forming an x-ray detectionassembly 1300. The alignment frame 1306 may aid with the registration ofthe detector arrays.

Detectors may be arranged on the scintillator/detector boards 1302 inany of numerous ways, and the invention is not limited to any particulararrangement. In some embodiments, for example, eachscintillator/detector board 1302 may comprise three rows of detectors,with each outer row comprising “32” separate detectors having a width ofthree millimeters, and the middle row comprising “64” separate detectorshaving a width of “1.5” millimeters. In such an embodiment, eachdetector/scintillator board 1302 would thus comprise “128” separatedetectors, each capable of making a distinct attenuation measurementD_(i), as discussed above. In the example shown in FIG. 13, the x-raydetection assembly 1300 includes a total of “9” scintillator/detectorboards 1302. Accordingly, in this example each detector bank comprises“9” detector rows. The detectors may be made of any of a number ofsuitable materials, and the invention is not limited to the use of anyparticular detector material. The detectors may measure spectralproperties and/or total energy. In some embodiments, for example, thedetectors may be made of cadmium tungstate (CdWO₄).

FIGS. 14A-B illustrate how several x-ray detection assemblies 1300 canbe assembled together to form portions of detector banks like thedetector banks 1110, 1112 discussed above. For example, the group offour x-ray detection assemblies 1300 shown in FIG. 14A may form one legof each of the L-shaped detector banks 1110, 1112, and each of the otherlegs of those detector banks may be formed by a group of four x-raydetection assemblies 1300 like that shown in FIG. 14B. The onlydifference between the structures of FIGS. 14A and B is that thestructure of FIG. 14A comprises “2” x-ray detection assemblies 1300A(each including “9” detector/scintillator boards) and “2” x-raydetection assemblies 1300B (each including “6” detector/scintillatorboards), whereas the structure of FIG. 14B comprises “3” x-ray detectionassemblies 1300A and “1” x-ray detection assemblies 1300B. The structureof FIG. 14B is thus slightly longer than that of FIG. 14A.

It should be appreciated that, in some embodiments, the detectors thatare employed need not be arranged in straight lines and may additionallyor alternatively be arranged in arcs or in other arrangements.

As is evident from a study of FIG. 12, a significant number of points inthe image space that is examined by the example system described inFIGS. 10-12 fall outside of the convex hull of the set of sources thesystem uses to create images, and also fall outside of the convex hullof the (virtual) set of sources reflected through the isocenter of theimage space. Accordingly, when a three-dimensional tomographic image iscreated with attenuation data accumulated with sources and detectorsarranged as shown, and using one or more of the techniques describedabove, an image may be created for which it is impossible to find anyvector in the image for which all source-detector ray directions form anangle between “85” and “95” degrees with the vector. In other words,such an inspection apparatus may form a tomographic image, in which, forall possible orientations of a three dimensional plane, the orientationvectors of at least some of the rays of radiation for which transmissiondata was accumulated and used to form the tomographic image form anangle of less than eighty-five degrees or greater than ninety fivedegrees with respect to the plane.

Nevertheless, the use of the above-described parallel implementation ofan iterative algorithm for forming a tomographic image based on the dataacquired by such a system allows the system to accurately reconstructsheet-like objects at arbitrary orientations. The systems and techniquesdescribed above allow, in some embodiments, the reconstruction of athree dimensional tomographic image having a half-width-half-maximum(HWHM) resolution that is substantially less than 5 millimeters in alldirections.

Though using multiple sources to illuminate each detector array reducesthe number of detectors required to construct an inspection system,interference between sources may result. It may thus be desirable tosequence the operation of the sources associated with the same detectorarray so that, at any time, each detector array is irradiated with raysfrom no more than one of the sources.

FIG. 15 shows an illustrative example of an x-ray generation system thatmay embody certain inventive features disclosed herein. As shown, thesystem comprises a pair of x-ray tubes 1502 and 1504, a high-voltagepower supply 1508, and associated control circuitry 1506. As discussedbelow, the tubes 1502 and 1504 may be configured and arranged toselectively generate x-rays that illuminate a common detector array1510. One or more x-ray generation systems like that shown may, forexample, be used in inspection systems such as those described above.The tubes 1502 and 1504 may, for example, correspond to the pair ofsources 1002 and 1004 in the embodiment of FIGS. 10-12 discussed above.In such a case, the detector array 1510 would thus correspond to thedetector bank 1110 in that same embodiment. The same or a similar typeof x-ray generation system may also, of course, be employed to form theseparate pair of sources 1006 and 1008 described above, with thedetector array 1510 likewise corresponding to the detector bank 1112 insuch a case. Similarly, the tubes 1502, 1504 and detector array 1510,and the techniques described herein, may correspond with thesource/detector combinations and imaging techniques described above inconnection with FIGS. 8 and 9.

The foregoing examples should not be deemed as limiting, however.Rather, it should be appreciated that the circuitry and techniques shownand described may provide a benefit in any circumstance where high-speeddual-energy radiation generation is desired. Although only two x-raytubes are shown and described, it should be appreciated that any numberof x-ray tubes, or other types of radiation generating elements, may beconstructed and controlled as illustrated and described below inalternative embodiments. Moreover, it should be appreciated that it isnot critical that more than one x-ray tube, or other type of radiationgenerating element, be employed in all circumstances, as a singlegridded, dual-energy tube like that described may find applications inany of numerous other environments.

As shown, a pair of switches 1512, 1514 are provided to allow thecontrol circuitry 1506 to independently control the voltage levels thatare applied across the two x-ray tubes 1502, 1504. Although the tubes1502 and 1504 in the example shown are constructed in the same fashion,it is not critical that the tubes be identical. In alternativeembodiments, tubes of different types or construction may be employed.For instance, in some embodiments, the two or more tubes that areemployed may generate different types of radiation. In the illustratedexample, the tubes 1502, 1504 are skewed so that they to irradiate asingle detector array 1510 from different angles. It should beappreciated, however, that one or more tubes and related circuitry likethat shown may additionally or alternatively be configured and operatedto irradiate one or more additional or different detectors, detectorarrays, or detector banks in alternative embodiments.

In FIG. 15, the x-ray tube 1502 is illustrated schematically by acathode 1516 and a target 1518, and the x-ray tube 1504 is similarlyillustrated schematically by a cathode 1520 and a target 1522. As in aconventional x-ray source, the cathodes 1516, 1520 may emit beams 1524,1526 of electrons. Either of the x-ray tubes 1502, 1504 may be caused toemit radiation 1528, 1530 by placing a high voltage between the cathode1516, 1520 and the target 1518, 1522 of that tube. The high voltagecauses the electrons in the corresponding beam 1524, 1526 to acceleratetowards its associated target 1518, 1522. When the electrons impact thetarget 1518, 1522, they have sufficiently high energy to cause thetarget 1518, 1522 to emit radiation in the form of x-rays.

The energy of the radiation 1528, 1530 emitted from the targets 1518,1522 is proportional to the potential difference between the targets1518, 1522 and the cathodes 1516, 1520. In the embodiment of FIG. 15,the high-voltage power supply 1508 generates a high voltage, e.g., 150KVolts (relative to a voltage at a reference node 1536), at a firstoutput 1532, and also generates and a lower voltage, e.g., 75 KVolts(relative to the voltage at the reference node 1536), at a second output1534. As shown, the reference output 1508 may be connected to each ofthe cathodes 1516, 1520, and each of the switches 1512, 1514 may beconfigured to connect a selected one of the supply outputs 1532, 1534 toa corresponding one of the targets 1518, 1522, thereby allowing aselected one of the high voltage and the low voltage to be appliedbetween the cathode 1516, 1520 and target 1518, 1522 of either x-raytube 1502, 1504. In addition, each of the switches 1512, 1514 may have athird position in which no potential difference is applied between thecorresponding cathode 1516, 1520 and target 1518, 1522. When either ofthe switches 1512, 1514 is in such a position, the corresponding x-raytube 1502, 1504 is effectively off.

In situations, such as several of those described above, where multiplex-ray tubes 1502, 1504 are used to illuminate the same detector array1510, it may be desirable to stop one of the tubes 1502, 1504 fromgenerating x-rays during those periods when the detector array 1510 isaccumulating and outputting data based on radiation from the othersource. One way that could be accomplished is by selectively switchingoff the x-ray tubes 1502, 1504 by placing the switches in their thirdpositions in which no potential is applied between the cathodes 1516,1520 and targets 1518, 1522. While suitable for some applications, thattechnique may be too slow for some applications due to the transientperiods involved. In the example embodiment shown in FIG. 15, each ofthe x-ray tubes 1502, 1504 advantageously includes a mechanism forselectively steering or redirecting its electron beam 1524, 1526 so thatit does not reach its target 1518, 1522 without requiring either thehigh or low voltage from the power supply 1536 to be removed frombetween its cathode 1516, 1520 and target 1518, 1522.

Such steering or redirecting of the electron beams 1524, 1526 could beaccomplished in any of a number of ways, and the invention is notlimited to any particular mechanism or technique for accomplishing sucha result. In the embodiment shown, a pair of grids 1538, 1540 areemployed for such a purpose. As shown, each of the grids 1538, 1540 maybe disposed in the path between one of the cathodes 1516, 1520 and itscorresponding target 1528, 1522. Any suitable method may be used tocontrol the grids 1338, 1540. In some embodiments, for example, thegrids 1338, 1540 may be selectively grounded to shunt the electrons inthe beams 1524, 1526 away from the targets 1518, 1522. In otherembodiments, the grids 1338, 1540 may be raised to a potential higherthan that of the targets 1518, 1522, which may also interrupt the beams1524, 1526. In any event, the control circuitry 1506 may somehowselectively control the operation of the grids 1538, 1540 so as toeither allow the associated electron beam 1524, 1526 to pass through thegrid 1538, 1540, or to inhibit the associated electron beam 1524, 1526from reaching its target 1518, 1522.

The control circuitry 1506 may control the timing of both theacquisition of data from the detector array 1510 and the generation ofradiation from the x-ray tubes 1502, 1504. For example, during a firstphase, the control circuitry 1506 may control the grid 1538 so that thex-ray tube 1502 generates radiation 1528, and may also control thedetector array 1510 so that the detectors in the array measure theintensity of the radiation that is received during that same phase. Theposition of the switch 1512, as determined by the control circuitry1506, may determine whether the generated radiation 1528 from the tube1502 has a high energy or a low energy. After such a phase, the grid1538 may be controlled so that the x-ray tube 1502 ceases generatingradiation. During a subsequent phase, the control circuitry 1506 maycontrol the detector array 1510 to output the intensity values measuredby the detectors, so as to allow attenuation measurements to be madebased upon those outputs. Once the outputs of the detector array 1510have been measured, the control circuitry 1506 may then control the grid1540 so that the x-ray tube 1504 generates radiation 1530, and may alsocontrol the detector array 1510 so that the detectors in the arraymeasure the intensity of the radiation 1530 that is received from thex-ray tube 1504. As with the tube 1502, the position of the switch 1514,as determined by the control circuitry 1506, may determine whether thegenerated radiation 1530 from the tube 1504 has a high energy or a lowenergy. The control circuitry may then control the grid 1540 so that thex-ray tube 1504 ceases generating radiation, after which time thecontrol circuitry 1506 may control the detector array 1510 to output theintensity values measured by the detectors, so as to allow attenuationmeasurements to be made based upon those outputs. The process may repeatin this fashion, alternating between measurements from the x-ray tubes1502 and 1504 (by properly controlling the grids 1538, 1540), and/oralternating between high and low energy measurements for each such tube(by properly controlling the switches 1512, 1514).

Thus, in embodiments in which dual energy measurements are made from twoskewed sources, the alternating pattern may involve a sequence includingfour separate radiation generation phases, with one of the two sourcesgenerating either high or low radiation during each such phase. Thevarious forms of radiation for exciting the detector array 1510 may beapplied in any of a number of possible sequences, and the invention isnot limited to any particular order. In some embodiments, for example,the control circuitry 1506 may control the switches 1512, 1514 and grids1538, 1540 so as to cause the tubes 1502, 1504 to generate radiation inthe following repeating sequence (1) high energy radiation from the tube1502, (2) low energy radiation from the tube 1502, (3) high energyradiation from the tube 1504, and (4) low energy radiation from the tube1504. In other embodiments, the control circuitry 1506 may, for example,control the switches 1512, 1514 and grids 1538, 1540 so as to cause thetubes 1502, 1504 to generate radiation in the following repeatingsequence (1) high energy radiation from the tube 1502, (2) high energyradiation from the tube 1504, (3) low energy radiation from the tube1502, and (4) low energy radiation from the tube 1504. Other similarpatterns are also possible.

The timing diagrams of FIGS. 16 and 17 illustrate two examples of howthe control circuitry 1508 may control the switches 1512, 1514 and grids1538, 1540 to cause the x-ray tubes 1502, 1504 to selectively generatehigh and low energy radiation in suitable patterns. As shown, bothtiming diagrams include a waveform 1610 or waveforms 1610A, 1610B whichrepresent the voltages applied to the tubes 1502, 1504 (between therespective cathodes 1516, 1520 and targets 1518, 1522). Both diagramsfurther include waveforms 1612 and 1614 which represent whether thegrids 1538 and 1540, respectively, are “on” or “off.” Finally, bothdiagrams include waveforms 1616 and 1618 which represent the voltagesthat are applied to the tubes 1502 and 1504, respectively, duringperiods when they emit radiation.

In the example of FIG. 16, because the same voltage is applied to bothtubes 1502, 1504 at all times, it would not be necessary to employ twoseparate switches 1512, 1514 to control the application of high andvoltages to the tubes. Thus, in embodiments that employ such atechnique, a single switch may control whether both targets 1518, 1522are connected to either the “high” output 1532 or the “low” output 1534of the power supply 1508. In the example of FIG. 17, however, thevoltages applied to the x-ray tubes 1502, 1504 are different atdifferent times. The use of two separate switches 1512, 1514 in such asituation allows the voltages applied to the tubes to be separatelycontrolled in such a manner. In FIG. 17, the waveform 1610A may thusrepresent the voltage applied to the tube 1502 via the switch 1512, andthe waveform 1610B may represent the voltage applied to the tube 1504via the switch 1514.

In embodiments where different groups of sources are used to illuminaterespective detector arrays, such as the embodiment described above inconnection with FIGS. 10-12, the voltage 1610 that is applied to thex-ray tubes used to illuminate one detector array (or bank of detectorarrays) may be controlled so as to be out of phase with the voltageapplied to the x-rays tubes used to illuminate the other detector array(or bank of detector arrays), so that both sets of tubes will not emithigh-energy radiation at the same time, thus minimizing the total amountof radiation that is emitted by the system at any one time.

The duration of time for which each of the tubes 1502, 1504 is emittingradiation may depend on the characteristics of the detector array 1510.Circumstances may exist in which the access time to collect themeasurements from the detector array 1510 is relatively long. Forexample, in some circumstances, “10” milliseconds to collect the outputsfrom the detector 1510 may be considered a relatively long time intervalbecause in such an interval an item under inspection may move anappreciatable distance on the conveyor 120 (FIG. 1). As a result, if thedetector array 1510 were illuminated continuously during this “10”millisecond acquisition interval, the acquired data would appearblurred, in much the same way that a photograph of a moving object mayappear blurred. To avoid this blurring of the data used to form an x-rayimage, each source may be controlled to turn on for a relatively smallinterval of time, for example, “1” millisecond, or “ 1/10” of the totalacquisition interval, at the beginning of each acquisition interval.

In some embodiments, such abbreviated illumination intervals may beformed, for example, by using one of the switches 1512, 1514 to turn“on” and “off” one of the x-ray sources for the illumination intervalperiod. In other embodiments, the grids 1338, 1540 may be employed forsuch a purpose. As noted above, the use of the grids 1338, 1540 mayallow for faster switching than the use of the switches 1512, 1514.Thus, by incorporating the grids 1338, 1540 as control mechanisms, aninspection system employing an x-ray source as illustrated in FIG. 15may be able to quickly switch between sources or energy levels with lessblurring or other artifacts of the measured image.

By employing one or more x-ray generation systems configured andoperated in a dual energy mode as described in connection with FIGS.15-17 in an inspection system configured and operated as described abovein connection with FIGS. 1-14, volumetric images can formed from thedensity of the item under inspection, the effective atomic number(Z_(eff)) of the item under inspection, or a combination of density andZ_(eff).

Having thus described several aspects of at least one embodiment of thisinvention, it is to be appreciated that various alterations,modifications, and improvements will readily occur to those skilled inthe art.

For example, the invention was illustrated by describing a system inwhich multiple views of an item under inspection are used to form avolumetric image. However, it should be noted that the sources anddetector arrays used to make measurements for computing a volumetricimage may additionally or alternatively be used to form one or moreprojection images.

In some embodiments, an inspection system such as described herein mayperform multiple levels of inspection. For example, the system could beused in a first mode in much the same way that a convention multiviewprojection imaging system is used. If inspection of an item in multiviewprojection imaging mode did not result in clearing the item, the itemcould then be further inspected in the same equipment using a volumetricimaging mode.

In some embodiments, an inspection system such as described herein couldoperate in two modes, for example, by temporarily reversing thedirection of the conveyor 122 after inspection of an item in the firstmode. By reversing the direction of the conveyor, an item underinspection would be moved past the sources and detectors again and moredata could be collected to allow formation of a volumetric image.Alternatively, all data needed to form either multiview projectionimages or volumetric images could be collected at one time, butcomputations to perform a volumetric image could be performed only ifprojection imaging did not result in the item being cleared.

In some embodiments, some or all of the systems and techniques describedabove may be employed using gamma rays some other form of radiation inaddition to or in lieu of x-rays. The sources that are employed in thevarious embodiments may be monochromatic, polychromatic, or may beoperated at multiple energy points. In other embodiments, the x-raysources that are employed may comprise fixed e-beam tubes that scan anextended target such as those described in U.S. Provisional App. Ser.No. 60/846,164, incorporated by reference above.

In some embodiments, an x-ray inspection system having some or all ofthe features described herein may use backscatter, forward scatter orside scatter data in addition to or in lieu of x-ray transmission datato obtain an image. In such a system, an image may be formed bycombining transmission data with scattering data to allow for materialdiscrimination.

In some embodiments, an obtained image may be combined with other sensordata, such as radar, microwave data and/or neutron response data, and/ortrace detection to allow for material discrimination.

In some embodiments, some or all of the configurations and techniquesdescribed herein may be employed in a system where the sources anddetector arrangements are fixed relative to one another on a gantry, andthe gantry as a whole undergoes motion. Such motion of the gantry may bein addition to or in lieu of motion by a conveyor.

In some embodiments, an inspection system may comprise two or moredissimilar machines designed using configurations and techniquesdescribed herein where an item under inspection is passed from onemachine to the other in the same orientation. In other embodiments, aninspection system may comprise two or more similar machines designedusing configurations and techniques described herein where theorientation of an item under inspection is changed, e.g., rotated,between scans by the machines. In yet other embodiments, the samemachine may be configured to scan the same item under inspection twice,e.g., by scanning in a forward direction and then reversing thedirection of the conveyor and scanning in a backward direction, rotatingthe object between scans.

In some embodiments, an image may be formed, based upon data acquiredusing the configurations and techniques discussed above, usingtomosynthesis in addition to or in lieu of iterative tomography.

The apparatus and techniques described herein may be used for anysuitable purpose and need not be used for examination of luggage forcontraband or explosives. For example, embodiments of the invention mayadditionally or alternatively be used for medical imaging and/or fornon-destructive testing purposes.

Such alterations, modifications, and improvements are intended to bepart of this disclosure, and are intended to be within the spirit andscope of the invention. Accordingly, the foregoing description anddrawings are by way of example only.

The above-described embodiments of the present invention can beimplemented in any of numerous ways. For example, the embodiments may beimplemented using hardware, software or a combination thereof. Whenimplemented in software, the software code can be executed on anysuitable processor or collection of processors, whether provided in asingle computer or distributed among multiple computers.

Further, it should be appreciated that a computer may be embodied in anyof a number of forms, such as a rack-mounted computer, a desktopcomputer, a laptop computer, or a tablet computer.

Also, a computer may have one or more input and output devices. Thesedevices can be used, among other things, to present a user interface.Examples of output devices that can be used to provide a user interfaceinclude printers or display screens for visual presentation of outputand speakers or other sound generating devices for audible presentationof output. Examples of input devices that can be used for a userinterface including keyboards, and pointing devices, such as mice, touchpads, and digitizing tables. As another example, a computer may receiveinput information through speech recognition or in other audible format.

Such computers may be interconnected by one or more networks in anysuitable form, including as a local area network or a wide area network,such as an enterprise network or the Internet. Such networks may bebased on any suitable technology and may operate according to anysuitable protocol and may include wireless networks, wired networks orfiber optic networks.

Also, the various methods or processes outlined herein may be coded assoftware that is executable on one or more processors that employ anyone of a variety of operating systems or platforms. Additionally, suchsoftware may be written using any of a number of suitable programminglanguages and/or conventional programming or scripting tools, and alsomay be compiled as executable machine language code or intermediate codethat is executed on a framework or virtual machine.

In this respect, the invention may be embodied as a computer readablemedium (or multiple computer readable media) (e.g., a computer memory,one or more floppy discs, compact discs, optical discs, magnetic tapes,flash memories, circuit configurations in Field Programmable Gate Arraysor other semiconductor devices, etc.) encoded with one or more programsthat, when executed on one or more computers or other processors,perform methods that implement the various embodiments of the inventiondiscussed above. The computer readable medium or media can betransportable, such that the program or programs stored thereon can beloaded onto one or more different computers or other processors toimplement various aspects of the present invention as discussed above.

The terms “program” or “software” are used herein in a generic sense torefer to any type of computer code or set of computer-executableinstructions that can be employed to program a computer or otherprocessor to implement various aspects of the present invention asdiscussed above. Additionally, it should be appreciated that accordingto one aspect of this embodiment, one or more computer programs thatwhen executed perform methods of the present invention need not resideon a single computer or processor, but may be distributed in a modularfashion amongst a number of different computers or processors toimplement various aspects of the present invention.

Computer-executable instructions may be in many forms, such as programmodules, executed by one or more computers or other devices. Generally,program modules include routines, programs, objects, components, datastructures, etc. that perform particular tasks or implement particularabstract data types. Typically the functionality of the program modulesmay be combined or distributed as desired in various embodiments.

Various aspects of the present invention may be used alone, incombination, or in a variety of arrangements not specifically discussedin the embodiments described in the foregoing and is therefore notlimited in its application to the details and arrangement of componentsset forth in the foregoing description or illustrated in the drawings.For example, aspects described in one embodiment may be combined in anymanner with aspects described in other embodiments.

Use of ordinal terms such as “first,” “second,” “third,” etc., in theclaims to modify a claim element does not by itself connote anypriority, precedence, or order of one claim element over another or thetemporal order in which acts of a method are performed, but are usedmerely as labels to distinguish one claim element having a certain namefrom another element having a same name (but for use of the ordinalterm) to distinguish the claim elements.

Also, the phraseology and terminology used herein is for the purpose ofdescription and should not be regarded as limiting. The use of“including,” “comprising,” or “having,” “containing,” “involving,” andvariations thereof herein, is meant to encompass the items listedthereafter and equivalents thereof as well as additional items.

1. A method for operating an inspection system, comprising: (a) movingan item under inspection in a first direction relative to and at leastpartially between at least first and second radiation sources and atleast one array of detectors, the array comprising detectors disposed ina first plane, and the first radiation source being positioned in asecond plane, separate from and parallel to the first plane, and thesecond radiation source being positioned outside the second plane; and(b) with the detector array, detecting radiation emitted by each of thefirst and second radiation sources at each of a plurality of times asthe item under inspection moves, with the first source emittingradiation towards the detector array at a first portion of the pluralityof times and the second source emitting radiation towards the detectorarray at a second portion of the plurality of times, the first portionbeing different than the second portion; and (c) computing a volumetricrepresentation of the item under inspection based on the detectedradiation at each of the plurality of times, wherein: the detector arraycomprises a first detector array and the computing the volumetricrepresentation further comprises computing the volumetric representationbased on measurements made with a second detector array, and the firstand second detector arrays are substantially spaced apart in the firstdirection; and the act (b) comprises: detecting radiation emitted by thefirst radiation source with each of the first and second radiationdetector arrays during first periods; and detecting radiation emitted bythe second radiation source with at least one of the first and secondradiation detector arrays during second periods that are substantiallynon-overlapping with the first periods.
 2. The method of claim 1,further comprising: (d) operating the first radiation source such that aray path extending linearly between at least one of the first and secondradiation source and the first detector array forms an acute angle withrespect to the first plane that is substantially in excess of threedegrees.
 3. The method of claim 2, wherein (d) further comprisesoperating the first radiation source such that the acute angle issubstantially in excess of five degrees.
 4. The method of claim 3,wherein (d) further comprises operating the first radiation source suchthat the acute angle is substantially in excess of ten degrees.
 5. Themethod of claim 1, further comprising: controlling the first radiationsource so as to cause the first radiation source to generate radiationduring the first periods but not during the second periods; andcontrolling the second radiation source to generate radiation during thesecond periods but not during the first periods.
 6. The method of claim1, wherein (a) comprises using a conveyor to move the item underinspection relative to the at least first and second radiation sourcesand the first and second radiation detector arrays.
 7. The method ofclaim 6, wherein the at least first and second radiation sources and theat least first and second radiation detector arrays remain stationarywith respect to a surface supporting the inspection system when (a) isperformed.
 8. The method of claim 6, wherein (a) comprises moving the atleast first and second radiation sources and the at least first andsecond radiation detector arrays relative to a surface supporting theinspection system.
 9. The method of claim 8, wherein (a) furthercomprises keeping the item under inspection stationary relative to thesurface supporting the inspection system.
 10. An apparatus, comprising:at least first and second skewed radiation sources; a detector array;means for moving an item under inspection in a first direction relativeto and at least partially between the at least first and second skewedradiation sources and the detector array; means for operating the atleast first and second skewed radiation sources such that the detectorarray detects radiation emitted by each of the first and second skewedradiation sources at different times to collect data representative of aplurality of rays passing through the item from different anglesrelative to the detector array, the plurality of rays comprising atleast a first ray from the first source to the detector array passingthrough a voxel of the item at a first angle and a second ray from thesecond source to the detector array passing through the voxel at asecond angle, the second angle differing from the first angle by atleast 10 degrees; and means for computing a volumetric representation ofthe item under inspection from the data collected at the different timeswhen the item under inspection is at a plurality of positions and whenthe first radiation source is emitting radiation and when the secondradiation source is emitting radiation, and the volumetricrepresentation having a resolution suitable for use in detecting asuspicious region.
 11. An apparatus, comprising: a frame; a plurality ofradiation sources supported by the frame; a plurality of radiationdetector arrays supported by the frame; a conveyor adapted andconfigured to move an item under inspection in a direction past theplurality of radiation sources and the plurality of radiation detectorarrays; and a processor coupled to receive data output from theplurality of radiation detector arrays, the data representing radiationfrom at least two of the radiation sources reaching said radiationdetector arrays after the radiation passes through the item underinspection when the item under inspection is positioned at each of aplurality of positions, the processor being adapted to compute from thedata received from the plurality of radiation detector arrays avolumetric image of at least a portion of the item under inspection,wherein: the plurality of radiation detector arrays are positioned alongthe direction of the conveyor; the plurality of radiation sources arepositioned and configured such that for each of the plurality ofradiation detector arrays: the radiation detector array is irradiatedfrom a group of radiation sources comprising at least two of theplurality of radiation sources and the at least two radiation sourcesare positioned to irradiate the radiation detector array from differentangles with respect to a plane in which the radiation detector array isdisposed, the plane being transverse to the direction of the conveyor;within each of the groups irradiating each of the radiation detectorarrays, the radiation sources of the group emit radiation at differenttimes; and the data received at the processor from the plurality ofradiation detector arrays represents radiation detected at the differenttimes.
 12. The apparatus of claim 11, further comprising a controllerconfigured to control a first and second radiation sources in each ofthe groups so that the first radiation source illuminates a radiationdetector array during first periods, and so that the second radiationsource illuminates the radiation detector array during second periodsthat are substantially non-overlapping with the first periods.
 13. Theapparatus of claim 11, wherein the different times comprisenon-overlapping intervals.
 14. The apparatus of claim 11, wherein eachgroup of radiation sources comprises at least one radiation sourcepositioned such that rays between the radiation source and a radiationdetector array of the plurality of radiation detector arrays impinge ondetectors in the radiation detector array from an angle in excess ofthree degrees relative to the normal to the conveyor.
 15. The apparatusof claim 11, wherein each group of radiation sources comprises at leastone radiation source positioned such that rays between the radiationsource and a radiation detector array of the plurality of radiationdetector arrays impinge on detectors in the radiation detector arrayfrom an angle in excess of five degrees relative to the normal to theconveyor.
 16. The apparatus of claim 11, wherein each group of radiationsources comprises at least one radiation source positioned such thatrays between the radiation source and a radiation detector array of theplurality of radiation detector arrays impinge on detectors in theradiation detector array from an angle in excess of ten degrees relativeto the normal to the conveyor.
 17. The apparatus of claim 11, whereinthe processor is further adapted to control the first and second skewedsources to emit radiation during alternating intervals and to controlthe third and fourth skewed sources to emit radiation during alternatingintervals.
 18. The apparatus of claim 17, wherein: each of the pluralityof radiation sources is each adapted to emit radiation at each of twoenergy levels; the processor is further adapted to compute thevolumetric image from data received from the plurality of radiationdetector arrays at times during which the plurality of radiationdetector arrays are being irradiated with radiation at each of the twoenergy levels.
 19. An inspection system comprising: an inspection area;a conveyor adapted to move an item under inspection through theinspection area along an axis; a plurality of detector arrays adjacentthe inspection area, the plurality of detector arrays being separatedalong the axis, each of the plurality of detector arrays disposed in adifferent plane transverse to the axis; a plurality of groups of sourcesadjacent the inspection area, each group being associated with arespective detector array of the plurality of detector arrays and eachgroup comprising a plurality of sources, each of the plurality ofsources in each group being adapted and configured to emit radiationtoward the respective detector array, the plurality of sources in eachgroup being adapted and configured to irradiate the respective detectorarray at different times, and at least a portion of the plurality ofsources being collimated to irradiate more than one of the plurality ofdetector arrays; and a computer adapted to compute a volumetric image ofthe item under inspection using attenuation measurements collected fromeach of the plurality of detector arrays while irradiated by each of theplurality of sources in a respective group of sources while the itemunder inspection is in a plurality of locations within the inspectionarea, wherein each of the plurality of detector arrays comprises anL-shaped detector array.
 20. The inspection system of claim 19, whereinthe computer is further adapted to identify, based on the volumetricimage, a suspicious region.
 21. The inspection system of claim 19,wherein: the volumetric image is adapted for identification of asuspicious region by a human operator; and the inspection system furthercomprises a display coupled to the computer for display of thevolumetric image.
 22. The inspection system of claim 19, wherein each ofthe plurality of L-shaped detector arrays comprises a plurality ofdetector elements.
 23. The inspection system of claim 22, furthercomprising a controller adapted and configured to control the pluralityof sources of each of the plurality of groups to emit radiation, one ata time in separate intervals.
 24. The inspection system of claim 23,wherein each of the plurality of sources in each of the plurality ofgroups comprises a dual energy source adapted to emit radiation at afirst energy and a second energy.
 25. The inspection system of claim 24,wherein the controller is further adapted to control the plurality ofsources of each of the plurality of groups to emit radiation at thefirst energy and the second energy in alternating intervals.
 26. Theinspection system of claim 19, wherein at least some of the sourceswithin the plurality of groups of sources are adapted to irradiatemultiple detector arrays of the plurality of detector arrays.
 27. Theinspection system of claim 19, wherein the sources within each of theplurality of groups emit radiation during different intervals.
 28. Theinspection system of claim 27, wherein the attenuation measurements arecollected during the different intervals during which each of theplurality of detector arrays is illuminated by one source in therespective group of sources.
 29. An apparatus, comprising: a conveyor; aplurality of rows of detectors, the rows being separated along thelength of the conveyor; a first radiation source and a collimator, thecollimator being adapted and configured to direct a plurality of beamsof radiation from the first source, each beam being directed at a row ofthe plurality of rows during a first plurality of intervals; at leastone second radiation source, the at least one second source beingpositioned to irradiate each of the plurality of rows of detectorsduring a second plurality of intervals; a processor coupled to receivedata output from the rows of detectors and to compute from the datareceived from the plurality of rows of detectors a volumetric image ofat least a portion of the item under inspection, the received datarepresenting: radiation from the first radiation source reaching theplurality of rows of detectors after the radiation passes through theitem under inspection at each of a first plurality of times, andradiation from the at least one second radiation source reaching theplurality of rows of detectors after the radiation passes through theitem under inspection at each of a second plurality of times, differentthan the first plurality of times, wherein the collimator is adapted andconfigured to collimate radiation emitted by the first radiation sourceinto a plurality of fan beams, each fan beam directed at a different rowof the plurality of rows of detectors.
 30. The apparatus of claim 29,wherein the processor is further adapted to detect suspicious regions inthe volumetric image.
 31. The apparatus of claim 29, wherein thevolumetric image has sufficient resolution to support image analysis fordetection of suspicious regions.
 32. An apparatus, comprising: a frame;a plurality of radiation sources supported by the frame; a plurality ofradiation detector arrays supported by the frame; a conveyor adapted andconfigured to move an item under inspection in a direction past theplurality of radiation sources and the plurality of radiation detectorarrays; and a processor coupled to receive data output from theplurality of radiation detector arrays, the data representing radiationfrom at least one of the radiation sources reaching each of saidplurality of radiation detector arrays after the radiation passesthrough the item under inspection, the processor being adapted tocompute from the data received from the plurality of radiation detectorarrays a volumetric image of at least a portion of the item underinspection, wherein: at least one of the radiation detector arrays isdisposed substantially within a plane transverse to the direction ofconveyor motion; and the at least one detector array disposedsubstantially within the transverse plane is irradiated by at least oneradiation source disposed outside the transverse plane such thatradiation from the at least one radiation source is incident on the atleast one detector array from an angle relative to the plane of at least10 degrees.
 33. The apparatus of claim 32, wherein: each of theplurality of radiation sources is each adapted to emit radiation at eachof two energy levels; and the processor is further adapted to computethe volumetric image from data received from the plurality of radiationdetector arrays at times during which the plurality of radiationdetector arrays are being irradiated with radiation at each of the twoenergy levels.
 34. The apparatus of claim 32, wherein the processor isfurther adapted to identify, based on the volumetric image, a suspiciousregion.
 35. The apparatus of claim 32, wherein: the volumetric image isadapted for identification of a suspicious region by a human operator;and the apparatus further comprises a display coupled to the processorfor display of the volumetric image.
 36. The apparatus of claim 32,wherein each of the plurality of detector arrays comprises an L-shapeddetector array.
 37. The apparatus of claim 36, wherein each of theplurality of L-shaped detector arrays comprises a plurality of detectorelements.
 38. The apparatus of claim 37, further comprising a controlleradapted and configured to control the plurality of sources such that oneof the sources emits radiation toward the same detector array at onetime.
 39. The apparatus of claim 38, wherein each of the plurality ofsources comprises a dual energy source adapted to emit radiation at afirst energy and a second energy.
 40. The apparatus of claim 39, whereinthe controller is further adapted to control the plurality of sources toemit radiation toward each of the detector arrays at the first energyand the second energy in alternating intervals.
 41. The apparatus ofclaim 32, wherein at least some of the sources within the plurality ofsources are adapted to irradiate multiple detector arrays of theplurality of detector arrays.
 42. The apparatus of claim 32, wherein thesources irradiating the same detector array emit radiation duringdifferent intervals.
 43. The apparatus of claim 42, wherein theattenuation measurements are collected during the different intervalsduring which each of the plurality of detector arrays is illuminated byone source.
 44. The apparatus of claim 32, wherein the processor isfurther adapted to detect suspicious regions in the volumetric image.45. The apparatus of claim 32, wherein the volumetric image hassufficient resolution to support automated image analysis for detectionof suspicious regions.
 46. The apparatus of claim 32, wherein at least aportion of the plurality of sources each has a collimator adapted andconfigured to collimate radiation emitted by the radiation source into aplurality of fan beams, each fan beam directed at a row of radiationdetectors.